Hardware electronics engineer, PCB Designer, Embedded software developer
Summary
Taking ownership of projects and working in collaboration within multi-disciplinary teams during all phases of product development including generation of design concepts, feasibility research, conceptualization, prototyping, testing, functional verification, certification and mass production.
Ability to impart knowledge and provide/accept constructive criticism to/from peers and mentor junior members of the team.
Practical experience with digital systems (Cortex-M0/M3/M4/M7 cores) and various communication interfaces/peripheral: SPI/QSPI/SSI, 1-wire, I2C, USART/RS-232/485, MDB, CAN, FSMC, LVDS, DVI/HDMI, VGA, RGB, Ethernet, USB, PWM, ADC, DAC, RTC, WDT, DMA, GPIO, comparators, CRC engines, bootloaders, IAP/ISP firmware update, external memory. Integration of wireless technologies: MiWi, WiFi, Bluetooth, RFID, LoRa.
Strong firmware developing skills using C/C++ and assembler. Genuine understanding of software development philosophies, pointers, references, interface segregation, RTOS, etc.
Practical experience in Verilog programming, FPGA/CPLD design, simulation and verification
Proven experience in development of power conversion solutions AC/DC and DC/DC conversion topologies: fly-back/forward, buck/boost, synchronous rectification.
Precise and low-noise systems using standard linear building blocks such as operational amplifiers, comparators, BJT and FET transistors, active filters, references, ADCs and DACs.
Solid understanding of ESD and transient protection, EMC/EMI suppression and signal integrity principles for high-speed signals: grounding and shielding, impedance matching, reflection, propagation delay, plane splitting, differential signaling, termination, length tuning.
Hands-on experience with designing high-density multilayer PCBs, trace current capacity, ground and power plane splitting. Successful design of boards with high-speed SRAM/SDRAM, NAND memories, USB, Ethernet (PHY, RMII/MII).
Design for Manufacturing. Knowledge of modern PCB materials and technologies: cores, prepregs, surface finishes (HASL, ENIG, immersion silver/tin), tab-routing, V-scoring, via plugging, solder paste stencils, silk screens, solder masks. Genuine comprehension of real-world constraints in PCB production/assembly and its influence on the cost. Preparing production files including drawings, gerbers, drills, pick and place files.
Hands-on experience with a wide range of lab equipment: mixed-signal oscilloscopes, signal generators, spectrum analyzers, DMMs, programmable power supplies, firmware debug probes, solder irons, infrared and hot-air repair stations.
Skilled in developing software for testing devices in Python, QT Creator, Android studio (Kotlin).
Hands-on experience with mechanical design tools (AutoDesk), MATLAB and SPICE simulators.
Expectations
New intresting projects and friendly working team.
Employment Preferences
Relocation destinations:
- United States
Expected Base Salary
**0,000 USD
Expected Hourly Rate
** USD/hr
Academic Degree
Experience
Total Professional Experience
Skills
- Altium
- PCB
- MCU
- FPGA
- CPLD
- ADCs
- DACs
- SPI
- QSPI
- SSI
- 1-wire
- I2C
- USART
- RS-232
- MDB
- CAN
- FSMC
- LVDS
- DVI
- HDMI
- VGA
- RGB
- Ethernet
- MQTT
- USB
- PWM
- ADC
- DAC
- RTC
- WDT
- DMA
- GPIO
- SRAM
- SDRAM
- NAND
- MiWi
- WiFi
- Bluetooth
- RFID
- LoRa
- C
- Assembler
- Python
- QT Creator
- Android Studio
- Kotlin
- Solder Iron
- Hot Air Station
- Oscilocope
- Multimeter
- Signal Generators
- Spectrum Analyzers
- Programmable Power Supplies
- Firmware Debug Probes
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